Desc: |
- This semi automatic wafer mounter optimizes to applying 12" & 8" wafer, dicing frame and film.
- It improves performance in all ways: quality, operability and lamination repeatability.
- It promises to meet diversifying customer demands for stable operation that does not require special skills, film-specific numerical control over lamination conditions, etc.
- This model was developed for both pre-cut and normal tape, easy to change both function.
|
Char: |
- Available for both pre-cut and normal film.
- The cutting span of the film can be adjusted.
- Higher productivity than general semi-auto mounter.
- User-settable parameters, including lamination pressure, speed, and temperature.
- The film tension controlled by the digital controller, set & store the optimal value for different film.
- The touch panel can set and store multiple sets of film parameters.
- An excellent touch panel in the functionality and operativeness is adopted.
- Safety interlock function.
- Variable lamination pitch for normal tape.
- Tension-free lamination.
- Bubble-free lamination.
- Equipped with measures against static electricity.
- Multiple safety measures, safety light curtains, door sensor and emergency button.
- Compact, light-weight, and small-footprint type.
|