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Desktop LED Debonding Machine
Description
The LED debonding machine series program-controlled LED curing system provides precision-controlled and repeatable LED tape curing for single-frame processing of wafers.
Features
- Simple operation with one-touch adhesive debonding.
- Built-in light source intensity sensor, with human-machine interface displaying light source intensity and accumulated total irradiance.
- Equipped with over-temperature protection function, automatically turning off the light when the debonding chamber overheats.
Specifications
| Model | UVDE-612 |
| Wafer Frame Size | 6″ / 8″ / 12″ |
| Light Source Wavelengths | UV-A 365 |
| Light Source Intensity | 12 ~ 18 |
| Maximum Illumination Area | 350 * 350 |
| Dimensions | 600(W) x 650(L) x 290(H) |
| Weight | 45 |